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A new generation thermal insulation material LOGICPIR by TECHNONICOL based on rigid polyisocyanurate foam significantly surpasses traditional solutions in terms of technical characteristics and consumer values. Being very rigid and perfectly flat, it is an ideal substrate for roofing materials on flat and pitched roofs, while also widely used in construction systems of floors, walls and facades.
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02.06.2020
A new generation thermal insulation material LOGICPIR by TECHNONICOL based on rigid polyisocyanurate foam significantly surpasses traditional solutions in terms of technical characteristics and consumer values. Being very rigid and perfectly flat, it is an ideal substrate for roofing materials on flat and pitched roofs, while also widely used in construction systems of floors, walls and facades.
This video will tell how outstanding properties and features of LOGICPIR are being achieved and tested at the production facility of TECHNONICOL Corporation for further delivery to thousands of projects around the world.
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